• DocumentCode
    3416504
  • Title

    Comparative Analysis of Intel Pentium 4 and IEEE/EMC TC-9/ACEM CPU Heat Sinks

  • Author

    Lu, Junwei ; Duan, Xiao

  • Author_Institution
    Griffith Univ., Brisbane
  • fYear
    2007
  • fDate
    9-13 July 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper presents finite element frequency domain results for electromagnetic radiation emitted from high power microelectronic circuits connected to a heat sink. The heat sink model associated with one of the IEEE EMC TC-9 challenging problems, 2000-4 CPU heat sink, has been used to investigate different grounding configurations. A new simulation model for the Intel P4 CPU heat sink is proposed. In contrast to the 2000-4 EMC challenging model, Intel P4 CPU heat sink model exhibited different results. A resonant frequency of 2.6 GHz with a reflection coefficient of -8.3 dB was found for the Intel P4 CPU heat sink, which is close to the operating frequency of 2.4 GHz for IEEE and Bluetooth wireless communication systems. The comparison of frequency sweeping results shows that the reflection coefficient was found to be -16 dB at 3.6 GHz and -20 dB at 3.4 GHz from conventional CPU heat sink. The CPU heat sink can perform as an efficient radiator at these frequencies.
  • Keywords
    electromagnetic compatibility; finite element analysis; frequency-domain analysis; heat sinks; Bluetooth wireless communication system; IEEE/EMC TC-9/ACEM CPU heat sink; Intel Pentium 4; electromagnetic compatibility; electromagnetic radiation; finite element frequency domain; power microelectronic circuit; resonant frequency; Central Processing Unit; Circuits; Electromagnetic compatibility; Electromagnetic heating; Electromagnetic radiation; Finite element methods; Frequency domain analysis; Heat sinks; Microelectronics; Reflection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-1349-4
  • Electronic_ISBN
    1-4244-1350-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2007.86
  • Filename
    4305666