• DocumentCode
    3416706
  • Title

    Power Delivery for High Performance Processor Packages - Part I

  • Author

    Hockanson, David M. ; Dibene, J. Ted

  • Author_Institution
    Sun Microsyst. Inc., Stanford
  • fYear
    2007
  • fDate
    9-13 July 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The continued reduction in processor core voltage, increases in current required, chip density and size place more pressure on effectively controlling the impedance of a CPU power distribution system. Voltage fluctuations across the die limit functionality and speed. The core-power path from the die to the voltage regulator is discussed herein. The path is separated into segments, and a one-dimensional circuit model is created to aid in the discussion.
  • Keywords
    cores; electronics packaging; voltage regulators; CPU power distribution system; chip density; high performance processor packages; power delivery; processor core voltage; voltage fluctuations; voltage regulator; Circuits; Control systems; Impedance; Packaging; Power distribution; Pressure control; Regulators; Size control; Voltage control; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-1349-4
  • Electronic_ISBN
    1-4244-1350-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2007.98
  • Filename
    4305678