Innovation problems in MCM technology

There have been many false starts for the multichip module (MCM) industry. Complications have arisen due to its function as a sub-assembly and the lack of a viable infrastructure covering the supply of die, substrates, final packaging and associated design and test support. Many of these problems are being addressed as the use of MCMs increase due to the growth in portable technology and the anticipated decline in costs. A number of innovations are also taking place around the world to accelerate the use and building of the MCM infrastructure. In Europe there is EUROPRACTICE, in the USA the MIDAS programme and in Japan the vertically integrated influence. In Taiwan ITRI recently opened a foundry (APack Technologies Inc.) for MCMs and is one of the three licensees of the AT&T MCM technology. This paper looks at a number of issues influencing the introduction of MCM technology, initiatives to accelerate this process and the projected use over the next five to ten years