Title :
Benchmark market pricing for single and multichip substrates
Author :
Christensen, Mark V.
Author_Institution :
Prismark Parners LLC, Cold Spring Harbor, NY, USA
Abstract :
Global pricing for substrates used in single and multichip modules is changing rapidly. Factors such as the market pressure on cofired ceramic substrates from high density organic substrates, the economics of large area processing for thin film, flexible film and built up multilayers, the establishment of new viable suppliers and real market demand are all contributing to price reduction. This paper, based on global surveys, places current market pricing in its historical context and provides forecasts for the major categories of substrate used in single and multichip modules
Keywords :
costing; economics; integrated circuit manufacture; multichip modules; substrates; benchmark market pricing; built up multilayer; cofired ceramic substrate; economics; flexible film; global survey; high density organic substrate; large area processing; multichip module; single chip module; thin film; Bonding; Ceramics; Costs; Multichip modules; Packaging; Pricing; Silicon; Substrates; Transistors; Wire;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581137
