Title :
A process to improve capability in North American electronics manufacturing
Author :
Gedney, Ron ; McElroy, Jim
Author_Institution :
Nat. Electron. Manuf. Initiative, Herndon, VA, USA
Abstract :
A methodology will be described that has the potential to make significant advances in the capability to manufacture electronics. Fourteen Technology Working Groups (TWGs) made up of people from industry, academia and government focus on manufacturing technology capabilities required to support five product segments within the electronics industry. The output of these groups is in the form of detailed Technology Roadmaps looking forward eight years. From these projections, a series of gaps are identified in the particular product segments that must be addressed to meet the future product needs. Project strategies are then formulated by Technology Implementation Groups (TIGs) to fill the voids that are projected. Specifics will include a review of the interconnect Requirements Roadmap and a summary of one of the joint NEM/ITRI projects currently underway to meet the technical, schedule and cost metrics that are projected for high volume portable electronics
Keywords :
electronic equipment manufacture; packaging; project management; strategic planning; Technology Roadmaps; Technology Working Groups; electronics industry; electronics manufacturing; high volume portable electronics; joint NEM/ITRI projects; manufacturing technology capabilities; product segments; project strategies; Costs; Electronics industry; Electronics packaging; Government; Job shop scheduling; Manufacturing industries; Manufacturing processes; Process planning; Supply chains; Technology planning;
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
DOI :
10.1109/ICMCM.1997.581140
