DocumentCode
3416838
Title
Trends in flip chip and advanced interconnection
Author
Francis, David H.
Author_Institution
Int. Interconnection Intelligence, Montara, CA, USA
fYear
1997
fDate
2-4 Apr 1997
Firstpage
25
Lastpage
28
Abstract
In the flip chip and advanced interconnect area, the number of patents being filed and awarded each year, continues to increase. Over the five year period 1990 to 1995, the average annual growth rate of patents issued in the US in this technology area was 44%. This paper discusses some of the more interesting patents
Keywords
flip-chip devices; integrated circuit interconnections; patents; USA; advanced interconnect area; flip chip interconnection; patents; technology area; Artificial intelligence; Electric breakdown; Flip chip; Intellectual property; Investments; Large scale integration; Logic; Multichip modules; Packaging; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1997., International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-3787-5
Type
conf
DOI
10.1109/ICMCM.1997.581141
Filename
581141
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