• DocumentCode
    3416874
  • Title

    Direct copper electrodeposition onto cobalt adhesion layer in alkaline bath

  • Author

    Wen-Zhong Xu ; Jing-Xuan Wang ; Hai-Sheng Lu ; Xu Zeng ; Jing-Bo Xu ; Xin-Ping Qu

  • Author_Institution
    Dept. of Microelectron., Fudan Univ., Shanghai, China
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The direct electroplating of copper film on an ultrathin cobalt film in the alkaline bath was investigated. The plating bath consists of CuSO4·5H2O and ethylenediamine. It is found that the ethylenediamine can well stop the cobalt reaction with copper ion and make the copper deposition on cobalt possible. The experimental results show that the copper films on the cobalt have a high preferential (111) orientation, very low surface roughness and low resistivity.
  • Keywords
    adhesion; copper; copper compounds; electroplating; hydrogen compounds; sulphur compounds; surface roughness; CuSO4H2O; alkaline bath; cobalt adhesion layer; cobalt reaction; copper film; copper ion; direct copper electrodeposition; direct electroplating; ethylenediamine; plating bath; surface roughness; ultrathin cobalt film; Cobalt; Conductivity; Copper; Current density; Films; Resistance; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6467673
  • Filename
    6467673
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3416874