DocumentCode :
3416920
Title :
MCM-C cost comparison: Fodel(R) vs. Diffusion PatterningTM vs. Green TapeTM
Author :
Page, J. ; Amey, D.I. ; Draudt, R. ; Inman, M. ; Horowitz, S.J.
Author_Institution :
DuPont Photopolymer & Electron. Mater., Research Triangle Park, NC, USA
fYear :
1997
fDate :
2-4 Apr 1997
Firstpage :
53
Lastpage :
58
Abstract :
In this paper, the results of a cost model study comparing Diffusion PatterningTM, Fodel(R), and Green TapeTM implementations of a 10 chip Viking SuperSPARCTM Module is reviewed. Results include a discussion of key assumptions and a sensitivity analysis performed to determine how assumptions influenced cost for each process. These results identify cost drivers, and suggest opportunities for improving the cost effectiveness of each process
Keywords :
costing; economics; integrated circuit manufacture; multichip modules; sensitivity analysis; Diffusion Patterning; Fodel; Green Tape; MCM-C cost comparison; Viking SuperSPARC module; cost model study; sensitivity analysis; workstation module; Ceramics; Circuits; Conducting materials; Costs; Multichip modules; Packaging; Sensitivity analysis; Substrates; Thick films; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multichip Modules, 1997., International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-3787-5
Type :
conf
DOI :
10.1109/ICMCM.1997.581147
Filename :
581147
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3416920
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