DocumentCode :
3417022
Title :
A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications
Author :
Kojima, Takashi ; Yamada, Yasushi ; Ciappa, Mauro ; Chiavarini, Marco ; Fichtner, Wolfgang
Author_Institution :
Toyota Central R&D Labs. Inc., Aichi, Japan
fYear :
2004
fDate :
24-27 May 2004
Firstpage :
289
Lastpage :
292
Abstract :
In this paper, a novel thermal compact model of IGBT power modules for automotive applications is proposed. This new technique combines the accuracy of the FEM approach with the fast computational performances of circuit simulators. Furthermore, a simple parameter definition method for power device models, which enables us to change the device characteristics dynamically, is introduced. These methods provide an excellent tool to investigate issues such as the temperature non-homogeneity in parallel-connected devices.
Keywords :
automotive electronics; circuit simulation; finite element analysis; insulated gate bipolar transistors; modules; power transistors; semiconductor device models; FEM; automotive traction applications; circuit simulators; electro-thermal simulation; parallel-connected devices temperature nonhomogeneity; parameter definition method; power IGBT modules; power device models; thermal compact model; Finite element methods; Insulated gate bipolar transistors; Power transistors; Road vehicle electronics; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
Type :
conf
DOI :
10.1109/ISPSD.2004.1332922
Filename :
1332922
Link To Document :
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