• DocumentCode
    3417024
  • Title

    EMI Resulting from Interconnected Printed Circuit Boards by a Coaxial Cable

  • Author

    Kayano, Yoshiki ; Inoue, Hiroshi

  • Author_Institution
    Akita Univ., Akita
  • fYear
    2007
  • fDate
    9-13 July 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    To provide basic considerations for the realization of methods for predicting the electromagnetic (EM) radiation from interconnected printed circuit boards (PCBs) by a coaxial cable, the characteristics of the EM interference of test model PCB are investigated in this paper by experiment and numerical modeling. Comparing the cases with and without the interconnection, the ground plane of the interconnected PCBs and the interconnection cable are dominant radiation factor in the lower frequencies. These factors construct large common-mode (CM) antenna. On the other hand, the total EM radiation at GHz frequencies is simply determined by the differential-mode (DM) current on the signal trace, and cross-talk current on the victim traces. Consequently, correct predictions of CM current at lower frequencies and cross-talk are keys to the prediction of the total EMI behavior of the interconnected PCBs, because the DM current on the signal trace can be predicted by transmission line theory.
  • Keywords
    coaxial cables; crosstalk; electromagnetic interference; electromagnetic waves; integrated circuit interconnections; printed circuits; EMI; coaxial cable; cross-talk current; differential-mode current; electromagnetic radiation prediction; interconnected printed circuit boards; radiation factor; transmission line theory; Circuit testing; Coaxial cables; Delta modulation; Electromagnetic interference; Electromagnetic modeling; Electromagnetic radiation; Frequency; Integrated circuit interconnections; Predictive models; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    1-4244-1349-4
  • Electronic_ISBN
    1-4244-1350-8
  • Type

    conf

  • DOI
    10.1109/ISEMC.2007.113
  • Filename
    4305693