Title :
Enhancing performance of network-on-chip architectures with millimeter-wave wireless interconnects
Author :
Deb, Sujay ; Ganguly, Amlan ; Chang, Kevin ; Pande, Partha ; Beizer, B. ; Heo, Deuk
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Washington, DC, USA
Abstract :
In a traditional Network-on-Chip (NoC), latency and power dissipation increase with system size due to its inherent multi-hop communications. The performance of NoC communication fabrics can be significantly enhanced by introducing long-range, low power, high bandwidth direct links between far apart cores. In this paper a design methodology for a scalable hierarchical NoC with on-chip millimeter (mm)-wave wireless links is proposed. The proposed wireless NoC offers significantly higher throughput and lower energy dissipation compared to its conventional multi-hop wired counterpart. It is also demonstrated that the proposed hierarchical NoC with long range wireless links shows significant performance gains in presence of various application-specific traffic and multicast scenarios.
Keywords :
Bandwidth; Delay; Design methodology; Fabrics; Millimeter wave communication; Millimeter wave technology; Network-on-a-chip; Power dissipation; Power system interconnection; Spread spectrum communication;
Conference_Titel :
Application-specific Systems Architectures and Processors (ASAP), 2010 21st IEEE International Conference on
Conference_Location :
Rennes, France
Print_ISBN :
978-1-4244-6966-6
Electronic_ISBN :
2160-0511
DOI :
10.1109/ASAP.2010.5540799