• DocumentCode
    3417185
  • Title

    Low loss, low temperature cofired ceramics with higher dielectric constants for multichip modules (MCM)

  • Author

    Kniajer, Galina ; Dechant, Kenton ; Apté, Prasad

  • Author_Institution
    Westaim Corp., Fort Saskatchewan, Alta., Canada
  • fYear
    1997
  • fDate
    2-4 Apr 1997
  • Firstpage
    121
  • Lastpage
    127
  • Abstract
    This paper describes the development of new Low Temperature Cofired Ceramic materials (LTCC) with higher dielectric constants (εr). These glass-ceramic materials have εr in the range of 17 to 85 and demonstrate very low dielectric losses (tanδ) at radio and microwave frequencies, with thermal expansion coefficient (CTE) matched to that of GaAs. Dielectric properties were studied in a frequency range of 1 kHz to 10 GHz, and results are presented along with the effects of material crystalline structure. The new family of materials can address the growing demand of electronic manufacturers to reduce package size, minimize energy losses, and eliminate stray electromagnetic radiation. Materials can be used for IC packaging, discrete components, in radar, antennas systems, cellular phones, and for development of new devices with optimized parameters in VHF and UHF
  • Keywords
    ceramics; dielectric losses; dielectric materials; multichip modules; permittivity; thermal expansion; 1 kHz to 10 GHz; LTCC; UHF; VHF; crystalline structure; dielectric constant; dielectric loss; electromagnetic radiation shielding; electronic packaging; energy loss; glass-ceramic; low temperature cofired ceramic; microwave frequency; multichip module; radio frequency; thermal expansion; Biological materials; Ceramics; Crystalline materials; Dielectric losses; Dielectric materials; Electronic packaging thermal management; High-K gate dielectrics; Microwave frequencies; Radar antennas; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1997., International Conference on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-3787-5
  • Type

    conf

  • DOI
    10.1109/ICMCM.1997.581159
  • Filename
    581159