DocumentCode
3417185
Title
Low loss, low temperature cofired ceramics with higher dielectric constants for multichip modules (MCM)
Author
Kniajer, Galina ; Dechant, Kenton ; Apté, Prasad
Author_Institution
Westaim Corp., Fort Saskatchewan, Alta., Canada
fYear
1997
fDate
2-4 Apr 1997
Firstpage
121
Lastpage
127
Abstract
This paper describes the development of new Low Temperature Cofired Ceramic materials (LTCC) with higher dielectric constants (εr). These glass-ceramic materials have εr in the range of 17 to 85 and demonstrate very low dielectric losses (tanδ) at radio and microwave frequencies, with thermal expansion coefficient (CTE) matched to that of GaAs. Dielectric properties were studied in a frequency range of 1 kHz to 10 GHz, and results are presented along with the effects of material crystalline structure. The new family of materials can address the growing demand of electronic manufacturers to reduce package size, minimize energy losses, and eliminate stray electromagnetic radiation. Materials can be used for IC packaging, discrete components, in radar, antennas systems, cellular phones, and for development of new devices with optimized parameters in VHF and UHF
Keywords
ceramics; dielectric losses; dielectric materials; multichip modules; permittivity; thermal expansion; 1 kHz to 10 GHz; LTCC; UHF; VHF; crystalline structure; dielectric constant; dielectric loss; electromagnetic radiation shielding; electronic packaging; energy loss; glass-ceramic; low temperature cofired ceramic; microwave frequency; multichip module; radio frequency; thermal expansion; Biological materials; Ceramics; Crystalline materials; Dielectric losses; Dielectric materials; Electronic packaging thermal management; High-K gate dielectrics; Microwave frequencies; Radar antennas; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Multichip Modules, 1997., International Conference on
Conference_Location
Denver, CO
Print_ISBN
0-7803-3787-5
Type
conf
DOI
10.1109/ICMCM.1997.581159
Filename
581159
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