Title :
Compact IPMs in transfer mold packages for low-power-motor drives
Author :
Majumdar, Gourab ; Iwasaki, Mitsutaka ; Fukunaga, Masanori ; Kong, Xiaoming
Author_Institution :
Mitsubishi Electr. Power Device Works, Fukuoka, Japan
Abstract :
This paper presents an excellent power module family for low power motor drives. The DIP-IPM (dual in-line package intelligent power module), with its transfer-mold packaging concept, is the most popular device, especially in today´s consumer inverter market, for its cost-effective performance and high reliability. In this paper, the features of this kind of IPM and the background technologies supporting this successful device family are described.
Keywords :
electronics packaging; encapsulation; invertors; modules; motor drives; transfer moulding; variable speed drives; 0.1 to 3.7 kW; 1200 V; 600 V; DIP-IPM; compact IPM; consumer inverter circuits; dual in-line package intelligent power module; encapsulation; low power variable speed control; low-power-motor drives; power module; transfer mold packages; Encapsulation; Inverters; Motor drives; Variable speed drives;
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
DOI :
10.1109/ISPSD.2004.1332935
