• DocumentCode
    3417367
  • Title

    Quantum dot superlattice structure for high efficiency solar cells utilizing a bio-template and damage-free neutral beam etching

  • Author

    Samukawa, Seiji

  • Author_Institution
    Inst. of Fluid Sci., Tohoku Univ., Sendai, Japan
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Silicon (Si) quantum dot (QD) superlattice structures are promising candidates for all-Silicon tandem solar cells. An original top-down process involving a bio-template etching mask and damage-free neutral beam etching has been developed in order to fabricate a sub-10-nm highly ordered and dense two-dimensional (2D) array (one layer) of Si nanodisks (Si-ND) with a silicon carbide (SiC) interlayer. The Si-ND 2D array with SiC interlayer had an extremely high optical absorption coefficient and high carrier transport due to the formation of a wide miniband. As a result, high efficiency solar cells with an open-circuit voltage of 0.556 V, short-circuit current of 31.3 mA/cm2, fill factor of 72%, and conversion efficiency of 12.6% were fabricated for the first time.
  • Keywords
    bio-inspired materials; etching; semiconductor quantum dots; semiconductor superlattices; silicon compounds; solar cells; wide band gap semiconductors; SiC; all-silicon tandem solar cells; bio-template etching mask; conversion efficiency; damage-free neutral beam etching; dense two-dimensional array; fill factor; high carrier transport; high efficiency solar cells; nanodisks; open-circuit voltage; optical absorption coefficient; quantum dot superlattice structure; short-circuit current; silicon carbide interlayer; size 10 nm; top-down process; voltage 0.556 V; Absorption; Arrays; Etching; Photonics; Photovoltaic cells; Silicon; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6467698
  • Filename
    6467698