Design and development challenges for complex laminate multichip modules

Author

Cotton, Christopher D. ; Kling, Dennis R. ; Sebesta, George

Author_Institution

Raytheon Co., Sudbury, MA, USA

fYear

1997

fDate

2-4 Apr 1997

Firstpage

196

Lastpage

201

Abstract

Multichip module (MCM) design in the past has focused on ceramic and deposited MCM technologies. More recently, laminate MCMs have emerged as viable solutions for many MCM applications, particularly where cost is a key concern. The majority of these laminate MCMs fall into the category of few chip modules containing 2-4 ICs. It can be shown, however, that laminate based MCMs can play a key role in the development of more complex modules. A Programmable Modem Module (PMM) MCM has been developed which consists of an 18 layer, 6.6×6.6 cm laminate substrate with 19 ICs (8 types), 53 passives, and 529 I/O in a pin grid array (PGA) format. This paper will discuss technology trade-offs and design issues associated with this module and similar complex laminates MCMs

Keywords

integrated circuit design; modems; multichip modules; Programmable Modem Module MCM; complex laminate multichip module; design; development; pin grid array; Ceramics; Circuits; Costs; Cotton; Electronics packaging; Field programmable gate arrays; Laminates; Modems; Multichip modules; Satellite communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581173

Filename

581173