Workstation MCM technology comparison with five designs

A ten-chip, high-performance workstation multichip module, implemented in MCM-D technology, was redesigned utilizing three ceramic technologies Fodel^(R), Diffusion Patterning^TM, and low temperature cofired ceramic-and one laminate-based approach. This paper shows the size, speed, thermal performance, and cost impacts of implementing the workstation module in the five different technologies. A detailed explanation of the factors driving module size in each technology is shown: wirebond fanout patterns, trace pitch via density, and substrate to PCB interconnection. Over 100 simulation runs which looked at the performance of critical address, control, and data lines were conducted. A metric for comparing module performance for the workstation module is presented with results for each technology. The cost of each of the five design options is detailed. The paper concludes with a summary of the general applicability of each technology