• DocumentCode
    3417415
  • Title

    Design and packaging of a Pentium(R)-processor-based MCM-D module for wearable personal computers, notebooks, and embedded control applications

  • Author

    Mok, Sammy ; Reinschmidt, Rob ; Smith, Larry

  • Author_Institution
    MicroModule Syst., Cupertino, CA, USA
  • fYear
    1997
  • fDate
    2-4 Apr 1997
  • Firstpage
    208
  • Lastpage
    213
  • Abstract
    We describe two generations of Pentium(R)-processor based MCMs. We identify the driving factors for the design, describe the designs, discuss the design issues and solutions, and report on results from thermal and EMI tests
  • Keywords
    computerised control; electromagnetic interference; integrated circuit design; microprocessor chips; multichip modules; notebook computers; portable computers; real-time systems; EMI testing; MCM-D module; Pentium processor; design; embedded control; notebook computer; packaging; thermal testing; wearable personal computer; Assembly; Clamps; Computer aided manufacturing; Connectors; Costs; Electromagnetic interference; Microcomputers; Packaging; Signal design; Thermal factors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multichip Modules, 1997., International Conference on
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-3787-5
  • Type

    conf

  • DOI
    10.1109/ICMCM.1997.581176
  • Filename
    581176
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3417415