Uniform copper electroplating for application to multichip modules

Electroplating is a vital component of MCM-technology because it is the most cost effective method available for deposition of thick copper interconnects. A vital issue in the use of electroplated copper is the uniformity of the deposit. Thickness uniformity of 5% is desirable but often difficult to obtain. A rotating disk electroplating process that consistently achieves the required uniformity has been developed. It is an extremely robust system, capable of reproducing the required uniformity in spite of great variations in electroplating conditions. The parameters that have been studied include uneven rotation rate, wobble, and fluctuating current. Studies have also been done on the effect that rotation speed has on both uniformity and deposition rate