Development of large area processing for thin film substrates

Author

Chieh, Eric ; Lykins, Jim ; Ho, Chung ; Moresco, Larry ; Koblis, Mitch ; Haranghy, Miklos ; Skinner, Michael ; Chen, Ted ; Garrou, Phil ; Cummings, Scott ; Heistand, Robert

Author_Institution

Micro Module Syst.

fYear

1997

fDate

2-4 Apr 1997

Firstpage

234

Lastpage

239

Abstract

Large Area Processing (LAP) has been developed to address the industry´s requirements for very fine lines and spaces (under 1 mil), fine via geometries, and very low manufacturing costs when compared to traditional wafer-based thin film interconnect technologies. At MicroModule Systems, LAP substrates are built on 400×400 mm panels using various metal, organic, and inorganic substrate starting materials. A photo-sensitive dielectric material from Dow (Photo-BCB), with copper traces and gold pad metallization. Each panel yields approximately a 10X improvement in available substrates per panel over 150 mm round wafers, resulting in a significant reduction in the cost to manufacture. The paper will trace the implementation of LAP substrate technology at MMS. We will review different substrate starting materials and process equipment challenges, and the impact of LAP implementation on a single-chip BGA application

Keywords

integrated circuit interconnections; integrated circuit packaging; substrates; thin films; 400 mm; Au; Cu; Dow; MicroModule Systems; Photo-BCB; copper trace; curing; gold pad metallization; inorganic substrate; interconnect technology; large area processing; lines and spaces; manufacturing cost; metal substrate; organic substrate; photo-sensitive dielectric material; single-chip BGA; thin film substrate; vias; Aerospace industry; Costs; Dielectric materials; Dielectric substrates; Dielectric thin films; Geometry; Manufacturing industries; Manufacturing processes; Space technology; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Multichip Modules, 1997., International Conference on

Conference_Location

Denver, CO

Print_ISBN

0-7803-3787-5

Type

conf

DOI

10.1109/ICMCM.1997.581181

Filename

581181