DocumentCode :
3417653
Title :
A very simple analytical approach of thermal modeling for magnetic components
Author :
Escribano, L.M. ; Zumel, P. ; Prieto, R. ; Oliver, J.A. ; Cobos, J.A.
Author_Institution :
Div. de Ingenieria Electron., Univ. Politecnica de Madrid, Spain
Volume :
3
fYear :
2005
fDate :
6-10 March 2005
Firstpage :
1944
Abstract :
This work is focused on the analysis of an analytical thermal model for magnetic components. This model can be used to predict the average temperature rise in the outer surface of the device using a very simple expression. The application scope of the model is shown from a practical point of view. An analytical procedure to calculate its parameters is proposed. Finally, the model has been validated using finite element analysis and measurements.
Keywords :
finite element analysis; magnetic devices; thermal analysis; analytical thermal model; finite element analysis; magnetic component; Electronic packaging thermal management; Equations; Filling; Finite element methods; Magnetic analysis; Magnetic cores; Predictive models; Temperature; Thermal resistance; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE
Print_ISBN :
0-7803-8975-1
Type :
conf
DOI :
10.1109/APEC.2005.1453320
Filename :
1453320
Link To Document :
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