DocumentCode
3417999
Title
Electrical characterisation of vertical vapor phase doped (VPD) RESURF MOSFETs
Author
van Dalen, R. ; Rochefort, C.
Author_Institution
Philips Res. Leuven, Belgium
fYear
2004
fDate
24-27 May 2004
Firstpage
451
Lastpage
454
Abstract
Publications on the optimisation of vertical RESURF MOSFETs typically only address the drift region. The drift region resistance decreases strongly with pitch size, potentially offering extremely low specific resistances when moving to smaller pitch sizes. However, at a certain pitch, one will have decreased the drift region component such that other contributions will start to play a dominant role and need to be taken into account when optimising such devices. Recently, the first vertical RESURF MOSFETs, manufactured using a trench etch and vapor phase doping (VPD) process, were presented with pitch size down to 4 μm. Based on the electrical characterisation of these devices, we evaluate the various contributions to the overall specific resistance and their effect on the attainable figure-of-merits (FOMs) of vertical RESURF devices with DMOS layout at such small pitch.
Keywords
etching; optimisation; power MOSFET; semiconductor device breakdown; semiconductor doping; 4 micron; DMOS layout device figure-of-merit; Miller gate charge; VPD RESURF MOSFET; drift region pitch size; drift region resistance; low specific resistance; optimisation; reverse breakdown voltage; trench etch process; vertical vapor phase doped MOSFET; Etching; Optimization methods; Power MOSFETs; Semiconductor device doping;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN
4-88686-060-5
Type
conf
DOI
10.1109/ISPSD.2004.1332975
Filename
1332975
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