In-line automated inspection for semiconductor assembly

Author

Wang, Shay-Ping T.

Author_Institution

Motorola Inc., Chandler, AZ, USA

fYear

1992

fDate

30 Sep-1 Oct 1992

Firstpage

127

Lastpage

134

Abstract

Several in-line automated inspection techniques for semiconductor assembly are discussed. First, the characteristics of in-line automated inspection are described. Then, a machine vision system that is being developed for TAB tape inspection is presented. Machine vision techniques for two-dimensional and three-dimensional flaw inspection are proposed. A laser/infrared technique, scanning laser acoustic microscopy (SLAM), and a 3D X-ray technique that are capable of nondestructive inspection are evaluated

Keywords

acoustic microscopy; automatic optical inspection; computer vision; nondestructive testing; tape automated bonding; 3D X-ray technique; TAB tape inspection; in-line automated inspection techniques; laser/infrared technique; machine vision system; nondestructive inspection; scanning laser acoustic microscopy; semiconductor assembly; three-dimensional flaw inspection; Application specific integrated circuits; Assembly systems; Bonding; High speed integrated circuits; Inspection; Machine vision; Microscopy; Semiconductor lasers; Simultaneous localization and mapping; X-ray lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-0740-2

Type

conf

DOI

10.1109/ASMC.1992.253783

Filename

253783