• DocumentCode
    3418251
  • Title

    A screen printable silicone-imide paste for high performance coatings and adhesives

  • Author

    Choi, Jin-O ; Kirsten, Rudy ; Rojstaczer, Sergio ; Riordan, Daniel

  • Author_Institution
    Occidental Chem. Co., Grand Island, NY, USA
  • fYear
    1997
  • fDate
    9-12 Mar 1997
  • Firstpage
    56
  • Abstract
    Summary form only given. A novel screen printable paste has been developed for use as a patterned protective coating or adhesive. This high purity, high solid content paste is based on a high temperature, thermoplastic silicone-imide resin that provides good thermal stability, low water absorption and hot-melt adhesion. By using either a stencil or a screen, a good resolution pattern can be obtained for a 60 μm thick baked layer. The fully cured coatings show low moisture absorption and excellent mechanical properties. The glass transition temperature is 165°C. The fully cured coatings can be bonded to alloy 42 metal substrate by laminating at 250°C. The paste can be used in non-conductive die-attach applications as well as an overcoat protective layer over rigid or flexible circuits
  • Keywords
    adhesion; printing; protective coatings; silicones; adhesive; alloy 42 metal substrate; baking; bonding; curing; glass transition temperature; hot-melt adhesion; lamination; mechanical properties; moisture absorption; nonconductive die attach; protective coating; screen printing; silicone-imide paste; thermal stability; thermoplastic resin; Absorption; Adhesives; Coatings; Mechanical factors; Moisture; Protection; Resins; Solids; Temperature; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials. Proceedings., 3rd International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-3818-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.1997.581255
  • Filename
    581255