Title :
A Systematic Semi-Numerical Approach for Modeling of Signal and Power Integrity of Electronic Packages
Author :
Li, Er-Ping ; Liu, En-Xiao ; Oo, Zaw Zaw ; Wei, Xingchang ; Zhang, Yaojiang ; Vahldieck, R.
Author_Institution :
Nat. Univ. of Singapore, Singapore
Abstract :
A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
Keywords :
S-matrix theory; electronics packaging; method of moments; moment method; multilayered electronic packages; power integrity; scattering matrix method; signal integrity; systematic seminumerical approach; Electronics packaging; Equivalent circuits; Matrix converters; Moment methods; Nonhomogeneous media; Power system modeling; Power systems; Semiconductor device packaging; Signal analysis; Substrates;
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
1-4244-1350-8
DOI :
10.1109/ISEMC.2007.188
