Integration of polymer/ceramic thin film capacitor on PWB

Author

Bhattacharya, S. ; Tummala, R.R. ; Chahal, P. ; White, G.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

68

Lastpage

70

Abstract

Electrical properties of various polymer-ceramic composites have been studied for use in integrated capacitors on PWB substrates. The dielectric constant of the composite is strongly dependent on the individual properties of polymer and ceramic materials. Epoxy is the material of choice for its compatibility with PWBs. Further, epoxy materials are not attacked by high PH environment during electroless plating of the capacitor electrodes. Photodefinable and nonphotodefinable materials have been evaluated for capacitor integration on PWBs using thin-film processes and screen printing. Lead magnesium niobate is selected as the filler material for its high dielectric constant value and its compatibility with most polymers

Keywords

filled polymers; particle reinforced composites; permittivity; printed circuit manufacture; thin film capacitors; PWB; capacitor integration; dielectric constant; electroless plating; epoxy materials; integrated capacitors; photodefinable materials; polymer-ceramic composites; polymer/ceramic thin film capacitor; screen printing; thin-film processes; Capacitors; Ceramics; Composite materials; Dielectric constant; Dielectric materials; Dielectric substrates; Dielectric thin films; Electrodes; Polymer films; Printing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581259

Filename

581259