Accurate Characterization of Package and Board Components for Efficient System Level Signal Integrity Analysis

In order to prevent or minimize signal integrity (SI) and electromagnetic compatibility (EMC) problems in high-speed microelectronic systems, efficient system-level analyses must be carried out at the pre-layout stage, so as to develop reliable design measures. For these analyses, an accurate characterization of package and board components is required to extract realistic circuit models within the frequency range of interest. In this contribution, novel techniques for the extraction of such models are presented.