• DocumentCode
    3418419
  • Title

    Cost/performance analysis for plastic package “ruggedization” and thermal enhancement

  • Author

    Nguyen, L. ; Tracy, D. ; Chen, A. ; Giberti, R. ; Hatch, J. ; DeRosa, J. ; Werner, B.

  • Author_Institution
    Nat. Semicond. Corp., Santa Clara, CA, USA
  • fYear
    1997
  • fDate
    9-12 Mar 1997
  • Firstpage
    88
  • Lastpage
    93
  • Abstract
    The Plastic Packaging Consortium (PPC), a Technology Reinvestment Project (TRP) funded by DARPA under SOL 94-27 addresses the needs required to build up and strengthen an on-shore infrastructure for “ruggedized”, thermally enhanced and high density low-cost plastic packages. The PPC is now in the second year of a two-year program. A number of technical advances has been made in various areas related to the materials of construction of the packages. However, such advances typically come at higher costs. The intention of the Program is to identify the various combinations of such advances so that the total cost of ownership would be reduced even though individual elements of the package may incur higher costs. This talk will discuss the cost/performance analysis for two arms under evaluation by the PPC, namely, package “ruggedization” and package “thermal enhancement.” “Ruggedization” refers to the strengthening of the plastic package to withstand the rigor of surface mounting without the need for dry bagging and baking the parts to avoid popcorning. “Thermal enhancement” refers to the need for higher heat dissipation without resorting to external heat sinks. SEMATECH´s Cost Resources Model (CRM) was used to analyze the process flows involved for these two Focus Areas. The cost of ownership for the various combinations of package enhancement will be discussed with respect to the performance level achieved. IBIS Associates´s Technical Cost Model (TCM) was applied for the flow of handling moisture sensitive devices at the board assembly level
  • Keywords
    assembling; cooling; cost-benefit analysis; integrated circuit modelling; integrated circuit packaging; plastic packaging; surface mount technology; board assembly level; cost of ownership; cost resources model; cost/performance analysis; heat dissipation; moisture sensitive devices; on-shore infrastructure; package enhancement; plastic package; ruggedization; surface mounting; technical cost model; thermal enhancement; Assembly; Building materials; Costs; Heat sinks; Moisture; Performance analysis; Plastic packaging; Postal services; Semiconductor device packaging; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials. Proceedings., 3rd International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-7803-3818-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.1997.581264
  • Filename
    581264