Hydrolytically stable aluminum nitride as a filler material for polymer based electronic packaging

Author

Howard, Kevin E. ; Knudsen, Arne K.

Author_Institution

Dow Chem. Co., Midland, MI, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

98

Lastpage

101

Abstract

A new filler material, SCAN, silica-coated aluminum nitride, has been developed by The Dow Chemical Company for microelectronic plastic packaging. SCAN is a hydrolytically stable aluminum nitride material with appropriate particle size distribution and thermal conductivity to be used as a filler material for molding compounds or glob-tops where power dissipation is required. The patented silica coating process imparts hydrolytic stability to the powder and modifies the surface chemistry to make it more compatible with resin formulations that have traditionally used fused silica

Keywords

aluminium compounds; ceramics; filled polymers; plastic packaging; silicon compounds; thermal conductivity; AlN-SiO₂; SCAN; electronic packaging; filler material; glob-top; hydrolytic stability; molding compound; particle size distribution; polymer; power dissipation; silica-coated aluminum nitride; surface chemistry; thermal conductivity; thermal management; Aluminum nitride; Chemicals; Coatings; Conducting materials; Microelectronics; Plastic packaging; Power dissipation; Silicon compounds; Stability; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581266

Filename

581266