Key technologies for future IC manufacturing: a view from Europe

Author

Van Rossum, M.

Author_Institution

MEC, Leuven

fYear

1992

fDate

30 Sep-1 Oct 1992

Firstpage

50

Lastpage

54

Abstract

Current European development trends in IC processing technologies are reviewed. Most research projects are presently carried out in the EEC framework (IESSI-ESPRIT), which therefore acts as a trendsetter in the field of submicron processing. Major efforts are devoted to the improvement of process control at sub-0.5-μm dimensions. Examples can be found in lithography and in the fields of rapid thermal processing (RTP), junction formation and ultraclean processing. In the area of metallization, two trends are clearly identified: the introduction of cluster tools and the shift from sputter deposition to CVD. Finally, CAD techniques are under development for improved process control in IC manufacturing

Keywords

chemical vapour deposition; integrated circuit technology; lithography; process control; rapid thermal processing; surface treatment; CAD techniques; CVD; EEC framework; Europe; IC manufacturing; IC processing technologies; IESSI-ESPRIT; cluster tools; junction formation; lithography; metallization; process control; rapid thermal processing; sputter deposition; submicron processing; ultraclean processing; CMOS digital integrated circuits; CMOS logic circuits; CMOS process; CMOS technology; Computer aided manufacturing; Europe; Lithography; Manufacturing industries; Manufacturing processes; Research and development;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-0740-2

Type

conf

DOI

10.1109/ASMC.1992.253835

Filename

253835