Plastic packaging modeling and characterization at RF/microwave frequencies

Author

Raid, S.M. ; Su, Wansheng ; Salama, Iman ; Elshabini-Riad, Aicha ; Rachlin, Michael ; Baker, Walter ; Perdue, James

Author_Institution

Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1997

fDate

9-12 Mar 1997

Firstpage

147

Abstract

Summary form only given. At high frequencies, material properties and properties of signal lines/interconnects are equally important. Thus, the present study deals with material (molding compound) characterization and modeling and characterization of lead frames and bond wires. While the microwave characterization of molding compounds can be utilized in a variety of plastic package structures, the objective of the modeling was to develop an electrical model of the 16 lead SOIC plastic package, which is popular for packaging wireless RFICs. The developed models have been successfully used by ITT GTC in developing a new generation of power amplifier RFICs. Measurement results, error analysis, and time domain package modeling techniques are presented

Keywords

dielectric loss measurement; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; lead bonding; microwave integrated circuits; microwave measurement; permittivity measurement; plastic packaging; strip line resonators; 16 lead SOIC plastic package; HP coaxial probe; RF frequency characterization; bond wires; dielectric constant measurement; dielectric materials; electrical model; error analysis; interconnects; lead frames; loss tangent measurement; material properties; microwave characterization; molding compound characterization; plastic packaging modeling; power amplifier RFICs; signal lines; stripline resonator; time domain package modeling techniques; wireless RFIC packaging; Bonding; Error analysis; Material properties; Plastic packaging; Power amplifiers; Power generation; Radio frequency; Radiofrequency integrated circuits; Time measurement; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials. Proceedings., 3rd International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-3818-9

Type

conf

DOI

10.1109/ISAPM.1997.581280

Filename

581280