Title :
Microwave characterization of packaging materials
Author :
Amey, Daniel I. ; Horowitz, Samuel J.
Author_Institution :
Dupont Electron., Research Triangle Park, NC, USA
Abstract :
A major test program to characterize advanced interconnection materials in the 1 to 20 GHz range was initiated. The material systems which were tested include a variety of new Thick Film and Low Temperature Cofired Ceramic (LTCC) dielectrics as well as alumina dielectrics. Gold and silver conductors were applied using conventional screen printing and the new FODELB photopatterning techniques. Thin film conductors on 96% Aluminia and copper clad FR-4, Polyimide, BT and PTFE printed wiring materials were also characterized as benchmarks. The presentation discusses the key attributes of each technology, the test method and data which shows that conventional Thick Film Materials exhibit good uniform properties suitable for applications in the 7+ GHz range and that LTCC Green TapeTM and photopatterned FODELB Thick Film materials significantly extend the operating frequency range of ceramic materials exhibiting performance previously only achievable with Thin Film and high performance printed wiring materials
Keywords :
ceramics; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; microwave integrated circuits; printing; 1 to 20 GHz; FODELB photopatterning techniques; Green Tape; LTCC; advanced interconnection materials; dielectrics; microwave characterization; operating frequency range; packaging materials; printed wiring materials; screen printing; test method; Ceramics; Conducting materials; Dielectric materials; Dielectric thin films; Materials testing; Packaging; System testing; Temperature; Thick films; Wiring;
Conference_Titel :
Advanced Packaging Materials. Proceedings., 3rd International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-3818-9
DOI :
10.1109/ISAPM.1997.581283
