Thermally stabilized flip-chip mounted monolithic oscillators using CPW technology

Author

Hirose, T. ; Tomioka, T. ; Yokokawa, S. ; Shimura, T. ; Watanabe, Y.

Author_Institution

Fujitsu Labs. Ltd., Kawasaki, Japan

Volume

1

fYear

1999

fDate

13-19 June 1999

Firstpage

95

Abstract

We have designed and fabricated a flip-chip mounted Ka-band monolithic oscillator using 0.15 /spl mu/m gate InGaP-InGaAs HEMT device and incorporating CPW technology. We obtained a thermal stability of 1.8 ppm//spl deg/C for the oscillation frequency. An asymmetric source feedback circuit topology was employed in order to optimize the feedback circuit and minimize chip area. We also demonstrate the thermal stability analysis to evaluate the contributions of the flip-chip micro-pillar thermal resistance.

Keywords

HEMT integrated circuits; MMIC oscillators; circuit stability; coplanar waveguide components; feedback oscillators; field effect MIMIC; flip-chip devices; integrated circuit design; integrated circuit packaging; millimetre wave oscillators; thermal analysis; thermal management (packaging); thermal stability; 0.15 micron; 20 to 100 C; 37 to 39 GHz; CPW technology; EHF; HEMT device; InGaP-InGaAs; Ka-band; MM-wave IC; asymmetric source feedback circuit topology; flip-chip micro-pillar thermal resistance; flip-chip mounted monolithic oscillators; oscillation frequency; thermal stability analysis; thermally stabilized oscillators; Circuit stability; Circuit topology; Coplanar waveguides; Feedback circuits; Frequency; HEMTs; Oscillators; Stability analysis; Thermal resistance; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779433

Filename

779433