DocumentCode :
341970
Title :
A comparison of high power solid state GaAs FETs versus microwave power modules from a user´s perspective: the Cooperative Engagement Capability program
Author :
Foreman, E.E. ; Smith, M.C.
Author_Institution :
Raytheon Syst. Co., St. Petersburg, FL, USA
Volume :
1
fYear :
1999
fDate :
13-19 June 1999
Firstpage :
333
Abstract :
This paper presents data resulting from a comparison between two alternate high power (>100 watts) transmitter technologies, solid state GaAs FETs and Microwave Power Modules (MPMs), used to drive individual elements of an airborne array for the Navy´s Cooperative Engagement Capability (CEC) program. The results should help others select between competing technologies when size, weight, cooling, and prime power concerns are critical (i.e., aircraft, satellites, ground mobile units, and high power arrays).
Keywords :
gallium arsenide; microwave field effect transistors; microwave power amplifiers; microwave power transistors; modules; power electronics; power field effect transistors; transmitters; travelling wave tubes; 100 W; Cooperative Engagement Capability program; GaAs; TWT; airborne array; high power solid state GaAs FETs; high power transmitter technologies; microwave power modules; Cooling; FETs; Gallium arsenide; Microwave antenna arrays; Microwave technology; Military aircraft; Multichip modules; Satellites; Solid state circuits; Transmitters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
Type :
conf
DOI :
10.1109/MWSYM.1999.779487
Filename :
779487
Link To Document :
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