DocumentCode
341978
Title
Coupling algorithm for MMICs in multi-chip assemblies with baffles
Author
Zhaoyang Wang ; Jackson, R.W.
Author_Institution
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Volume
1
fYear
1999
fDate
13-19 June 1999
Firstpage
385
Abstract
This paper presents a CAD algorithm for the approximate determination of the coupling between MMICs in multi-chip assemblies with baffles. The technique is suitable for use in layout-based circuit simulators and uses no numerical analysis. It has been tested by comparison with fullwave electromagnetic simulation.
Keywords
MMIC; circuit layout CAD; circuit simulation; multichip modules; CAD algorithm; MMICs; baffles; coupling algorithm; layout-based circuit simulators; multi-chip assemblies; Apertures; Assembly; Circuit simulation; Computational modeling; Coupling circuits; Design automation; Field effect MMICs; Microwave circuits; Packaging; Predictive models;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location
Anaheim, CA, USA
Print_ISBN
0-7803-5135-5
Type
conf
DOI
10.1109/MWSYM.1999.779499
Filename
779499
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