Title :
RF-MEMS switch module in a 0.25 μm BiCMOS technology
Author :
Kaynak, M. ; Wietstruck, M. ; Zhang, W. ; Drews, J. ; Scholz, R. ; Knoll, D. ; Korndörfer, F. ; Wipf, C. ; Schulz, K. ; Elkhouly, M. ; Kaletta, K. ; Suchodoletz, M.V. ; Zoschke, K. ; Wilke, M. ; Ehrmann, O. ; Mühlhaus, V. ; Liu, G. ; Purtova, T. ; Ulusoy,
Author_Institution :
IHP, Frankfurt (Oder), Germany
Abstract :
A BiCMOS embedded RF-MEMS switch module is demonstrated. The module consists of four main blocks: 1) RF-MEMS switch technology, 2) Switch models for design-kit implementation, 3) High Voltage (HV) generation and digital interface, 4) Flexible packaging. The RF-MEMS switch technology is detailed by focusing on the contact model, especially in the down-state. Electromagnetic (EM) and lumped-element models are demonstrated to integrate into foundry process design kit (PDK). The integrated on-chip HV generation and control circuitries are described. A flexible packaging technique is also introduced to package either standalone switches or circuits with several switches.
Keywords :
BiCMOS integrated circuits; electrical contacts; electronics packaging; lumped parameter networks; microswitches; BiCMOS technology; RF-MEMS switch module; contact model; control circuitry; design-kit implementation; digital interface; electromagnetic models; flexible packaging; foundry process design kit; integrated on-chip HV generation; lumped-element models; size 0.25 mum; BiCMOS integrated circuits; Contacts; Integrated circuit modeling; Packaging; Switches; Switching circuits; Tin; EM modeling; HV generation; Monolithic integration; RF-MEMS switch; mm-wave ICs; packaging;
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2012 IEEE 12th Topical Meeting on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4577-1317-0
DOI :
10.1109/SiRF.2012.6160150
