DocumentCode
3420556
Title
Fabrication and preliminary test results of BICEP (Background Imaging of Cosmic Extragalactic Polarization) bolometer
Author
Bae, Sum Y. ; Yoon, Ki-Won ; George, Thomas
Author_Institution
Jet Propulsion Lab., Pasadena, CA, USA
fYear
2005
fDate
30 Jan.-3 Feb. 2005
Firstpage
60
Lastpage
63
Abstract
We report the results of fabrication and testing for the world\´s most sensitive MEMS bolometer. Our bolometer is designed to map temperature gradients within the cosmic microwave background (CMB). The bolometer is capable of differentiating temperature differences in the CMB that are less than 10 parts per million. The key to this ultrahigh sensitivity is the "spider web" architecture fabricated from a suspended, metallized silicon nitride film. We report the results of fabrication and characterization of a novel spider web bolometer, the so-called BICEP (Background Imaging of Cosmic Extragalactic Polarization), capable of detecting the polarization as well as the intensity of the incident microwave radiation. The bolometer was characterized over a range of sub-Kelvin ambient temperatures. We report the results of the voltage response, time constant, and the "leakage" in the bolometer\´s responsivity to incident microwave polarizations. Finally, from our experimental results we have determined that the bolometer has a low noise equivalent power of 2-10-17W/Hz- 12 /.
Keywords
bolometers; cosmic background radiation; microsensors; temperature measurement; BICEP bolometer; Background Imaging of Cosmic Extragalactic Polarization; MEMS bolometer; SiN; cosmic microwave background; incident microwave polarizations; incident microwave radiation; spider web architecture; spider web bolometer; suspended metallized silicon nitride film; temperature gradients; time constant; voltage response; Bolometers; Fabrication; Metallization; Micromechanical devices; Microwave imaging; Polarization; Service oriented architecture; Silicon; Temperature sensors; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-8732-5
Type
conf
DOI
10.1109/MEMSYS.2005.1453867
Filename
1453867
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