DocumentCode
342069
Title
Three-dimensional, W-band circuits using Si micromachining
Author
Henderson, R.M. ; Weller, T.M. ; Katehi, L.P.B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume
2
fYear
1999
fDate
13-19 June 1999
Firstpage
441
Abstract
This paper presents results from the development effort of Si micromachined three-dimensional high density circuits for W-band operation. Measurements of the performance of a power distribution network in a multilayer environment show that on-wafer packaging improves performance and allows for high density integration, small size, and considerably reduced cost.
Keywords
coplanar waveguide components; integrated circuit interconnections; integrated circuit packaging; micromachining; millimetre wave integrated circuits; modules; silicon; 3D W-band circuits; 3D high density circuits; 90 to 94 GHz; EHF; Si; Si micromachining; multilayer environment; onwafer packaging; power distribution network; three-dimensional circuits; Ceramics; Costs; Integrated circuit interconnections; MMICs; Micromachining; Microwave antenna arrays; Nonhomogeneous media; Packaging; Phased arrays; Power systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location
Anaheim, CA, USA
Print_ISBN
0-7803-5135-5
Type
conf
DOI
10.1109/MWSYM.1999.779797
Filename
779797
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