Title :
Optimization of flip-chip interconnects for millimeter-wave frequencies
Author :
Jentzsch, A. ; Heinrich, W.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochfrequenztech., Berlin, Germany
Abstract :
The MM-wave performance of flip-chip interconnects in a coplanar environment is investigated. By means of electromagnetic simulation, different possibilities to improve return loss are presented and discussed. A further issue is the reduction of parasitic coupling between the chip and transmission-lines on the motherboard underpassing the chip.
Keywords :
flip-chip devices; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; losses; millimetre wave integrated circuits; multichip modules; EHF; MCM; MM-wave performance; coplanar environment; electromagnetic simulation; flip-chip interconnects; millimeter-wave frequencies; parasitic coupling reduction; return loss improvement; transmission-lines; Capacitance; Coplanar waveguides; Equivalent circuits; Frequency; Impedance; Inductance; Integrated circuit interconnections; Lead; Millimeter wave technology; Packaging;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779842
