Fully coupled electro-thermal simulation of MMICs and MMIC arrays based on a physical model

Author

Batty, W. ; Panks, A.J. ; Snowden, C.M.

Author_Institution

Inst. of Microwaves & Photonics, Leeds Univ., UK

Volume

2

fYear

1999

fDate

13-19 June 1999

Firstpage

693

Abstract

The first completely physical coupled electro-thermal model, suitable for large signal simulation of MESFET and HEMT based MMICs and MMIC arrays, on a timescale suitable for CAD, is presented. The model is validated experimentally by high resolution thermal imaging of a MMIC 38 GHz 3-stage balanced amplifier, mounted on a Cu/FR-4 substrate and cooled entirely by natural convection and radiation into free space.

Keywords

HEMT integrated circuits; MESFET integrated circuits; arrays; circuit simulation; field effect MIMIC; field effect MMIC; integrated circuit modelling; thermal analysis; 3-stage balanced amplifier; CAD; Cu/FR-4 substrate; HEMT based ICs; MESFET based ICs; MMIC arrays; MMICs; fully coupled electro-thermal simulation; high resolution thermal imaging; large signal simulation; natural convection cooling; physical model; thermal model; Circuit simulation; HEMTs; High-resolution imaging; MESFETs; MMICs; Microwave antenna arrays; Millimeter wave radar; Temperature dependence; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1999 IEEE MTT-S International

Conference_Location

Anaheim, CA, USA

Print_ISBN

0-7803-5135-5

Type

conf

DOI

10.1109/MWSYM.1999.779855

Filename

779855