DocumentCode
3421352
Title
Thermal modeling techniques for heat sinks for power electronics
Author
Branchaud, Tom
Author_Institution
Wakefield Eng., MA, USA
Volume
1
fYear
1997
fDate
23-27 Feb 1997
Firstpage
424
Abstract
This paper gives two computer modeling techniques for quickly analyzing the performance of a heat sink having an array of heat dissipating devices on the base. A case study is presented which compares a traditional heat sink model to the two techniques. Model construction time and solution time can be dramatically reduced
Keywords
circuit analysis computing; cooling; heat sinks; power electronics; thermal analysis; computer modeling techniques; heat dissipating devices; heat sinks; model construction time; power electronics; solution time; thermal performance; Cooling; Heat engines; Heat sinks; Heat transfer; Power electronics; Resistance heating; Space heating; Surface resistance; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 1997. APEC '97 Conference Proceedings 1997., Twelfth Annual
Conference_Location
Atlanta, GA
Print_ISBN
0-7803-3704-2
Type
conf
DOI
10.1109/APEC.1997.581486
Filename
581486
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