• DocumentCode
    3421756
  • Title

    Extraction of compensated σxxyy and σxy stresses from a single four-contact sensor using the spinning transverse voltage method

  • Author

    Bartholomeyczik, J. ; Kibbel, S. ; Ruther, P. ; Paul, O.

  • Author_Institution
    Inst. for Microsystem Technol., Freiburg Univ., Germany
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    This paper reports on a novel method for extracting two stress components separated from undesired signal contributions with a single four contact piezoresistive structure. To date, such results were obtained only using two separate four contact structures, e.g., Wheatstone bridges of piezoresistors and piezoFETs, or using structures with a larger number of contacts. The method proceeds by spinning the current in the device, similarly to the spinning current method for Hall devices. It features the capability of (i) extracting both σxxyy and σxy stresses, (ii) separating the stress dependent signals from other undesired signals, such as Hall voltages, thermoelectric voltages, and temperature dependent effects, and (iii) a straightforward integration into mixed signal systems without the necessity of any compensation of offsets due to the amplifier and A/D conversion stage. Further, the approach is even applicable to nonlinear devices.
  • Keywords
    electric sensing devices; electromechanical effects; mechanical contact; microsensors; piezoresistance; piezoresistive devices; resistors; stress measurement; σxxyy stress; σxy stress; A/D conversion stage; Hall devices; Hall voltages; Wheatstone bridges; amplifier; mixed signal system; nonlinear devices; piezoFET; piezoresistors; signal contributions; single four contact piezoresistive structure; single four contact sensor; spinning current method; spinning transverse voltage method; stress dependent signals; temperature dependent effects; thermoelectric voltages; Bridge circuits; Current measurement; Mechanical sensors; Mechanical variables measurement; Piezoresistance; Sensor phenomena and characterization; Silicon; Spinning; Thermal stresses; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453917
  • Filename
    1453917