Title :
Techniques and thermoplastics for encapsulating high performance coils
Author :
Patterson, J.F.B. ; Lang, J. ; Hozumi, M.
Author_Institution :
DuPont Polymers, Wilmington, DE, USA
Abstract :
Recent developments in thermoplastic encapsulation materials, molding techniques, and mold design for encapsulating high performance coils are reviewed. Recently developed encapsulation systems for UL 1446 Class F (155 C) and Class H (180 C) applications are discussed
Keywords :
coils; 155 degC; 180 degC; UL 1446 Class F; UL 1446 Class H; high performance coils; mold design; molding techniques; thermoplastic encapsulation materials; Assembly; Coils; Electromechanical sensors; Encapsulation; Injection molding; Resins; Solenoids; Stators; Thermal sensors; Transformers;
Conference_Titel :
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-0847-6
DOI :
10.1109/EEIC.1993.630950
