Flip chip soldering and adhesive bonding on organic substrates

Author

Jung, E. ; Aschenbrenner, R. ; Ostmann, A. ; Zakel, E. ; Reichl, H.

Author_Institution

Fraunhofer-Einrichtung FhG-IZM, Berlin, Germany

fYear

1995

fDate

4-6 Dec 1995

Firstpage

67

Lastpage

71

Abstract

Flip chip interconnections to organic substrates were realized using different techniques: soldering using mechanical solder ball bumps and adhesive bonding with isotropic conductive adhesive. Both approaches use an electrolessly deposited nickel-gold under bump metallization. The feasibility of these methods is demonstrated and their properties are compared

Keywords

adhesion; electroless deposition; flip-chip devices; gold alloys; integrated circuit metallisation; integrated circuit reliability; nickel alloys; organic compounds; soldering; NiAu; adhesive bonding; bump metallization; electrolessly deposited Ni-Au; flip chip interconnections; flip chip soldering; isotropic conductive adhesive; mechanical solder ball bumps; organic substrates; thermal cycling reliability; Assembly; Bonding; Conductive adhesives; Costs; Flip chip; Integrated circuit interconnections; Metallization; Nickel; Packaging; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.540996

Filename

540996