• DocumentCode
    3422490
  • Title

    SOI technologies from microelectronics to microsystems — Meeting the more than Moore roadmap requirements

  • Author

    Raskin, Jean-Pierre

  • Author_Institution
    Inst. of Inf. & Commun. Technol., Electron. & Appl. Math. (ICTEAM), Univ. Catholique de Louvain (UCL), Louvain-la-Neuve, Belgium
  • fYear
    2012
  • fDate
    Oct. 29 2012-Nov. 1 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency (reaching cut-off frequencies close to 500 GHz for nMOSFETs) and for harsh environments (high temperature, radiation) commercial applications. SOI also presents high resistivity substrate capabilities, leading to substantially reduced substrate losses. More recently, SOI technology has been emerging as a major contender for heterogeneous microsystems applications. In this work, we demonstrate the advantages of SOI technology for RF CMOS integration as well as for building thin film sensors on thin dielectric membrane and three-dimensional micro-electro-mechanical (MEMS) sensors and actuators co-integrated with their associated SOI CMOS circuitry.
  • Keywords
    CMOS integrated circuits; MOSFET circuits; integrated circuits; micromechanical devices; silicon-on-insulator; submillimetre wave integrated circuits; MEMS; Moore roadmap; RF CMOS; SOI CMOS circuitry; actuators; frequency 500 GHz; harsh environments; heterogeneous microsystems; microelectronics; nMOSFET; silicon-on-insulator; thin dielectric membrane; thin film sensors; three-dimensional micro-electro-mechanical sensors; CMOS integrated circuits; Micromechanical devices; Radio frequency; Sensors; Silicon; Silicon on insulator technology; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4673-2474-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2012.6467953
  • Filename
    6467953