Title :
SOI technologies from microelectronics to microsystems — Meeting the more than Moore roadmap requirements
Author :
Raskin, Jean-Pierre
Author_Institution :
Inst. of Inf. & Commun. Technol., Electron. & Appl. Math. (ICTEAM), Univ. Catholique de Louvain (UCL), Louvain-la-Neuve, Belgium
fDate :
Oct. 29 2012-Nov. 1 2012
Abstract :
This last decade Silicon-on-Insulator (SOI) MOSFET technology has demonstrated its potentialities for high frequency (reaching cut-off frequencies close to 500 GHz for nMOSFETs) and for harsh environments (high temperature, radiation) commercial applications. SOI also presents high resistivity substrate capabilities, leading to substantially reduced substrate losses. More recently, SOI technology has been emerging as a major contender for heterogeneous microsystems applications. In this work, we demonstrate the advantages of SOI technology for RF CMOS integration as well as for building thin film sensors on thin dielectric membrane and three-dimensional micro-electro-mechanical (MEMS) sensors and actuators co-integrated with their associated SOI CMOS circuitry.
Keywords :
CMOS integrated circuits; MOSFET circuits; integrated circuits; micromechanical devices; silicon-on-insulator; submillimetre wave integrated circuits; MEMS; Moore roadmap; RF CMOS; SOI CMOS circuitry; actuators; frequency 500 GHz; harsh environments; heterogeneous microsystems; microelectronics; nMOSFET; silicon-on-insulator; thin dielectric membrane; thin film sensors; three-dimensional micro-electro-mechanical sensors; CMOS integrated circuits; Micromechanical devices; Radio frequency; Sensors; Silicon; Silicon on insulator technology; Substrates;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2012 IEEE 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4673-2474-8
DOI :
10.1109/ICSICT.2012.6467953