Title :
Performance of any layer IVH structure multi-layered printed wiring board
Author :
Nishii, Toshihiro ; Nakamura, Shinji ; Takenaka, Toshiaki ; Nakatani, Seiichi
Author_Institution :
Matsushita Electron. Components Co. Ltd., Osaka, Japan
Abstract :
We have developed a new multi-layered printed wiring board (ML-PWB) with any layer IVH structure, dubbed “ALIVH”(Any Layer Inner Via Hole). This ALIVH design combines epoxy impregnated non-woven aramid laminates, via hole processing technology using a CO 2 laser and interconnection technology using conductive copper paste. Non-woven aramid made of extra strong and high thermal resistant aramid fiber has low dielectric constant and is light weight. Non-woven aramid laminates has excellent flatness and low thermal expansion coefficiency in plane. Therefore, ALIVH has a great potential to cope with flip chip bonding technology for MCM-L applications
Keywords :
printed circuit manufacture; ALIVH; Any Layer Inner Via Hole; CO2 laser; MCM-L; any layer IVH structure; conductive copper paste; dielectric constant; epoxy impregnated nonwoven aramid laminate; flatness; flip chip bonding; interconnection; multi-layered printed wiring board; thermal expansion coefficient; thermal resistant fiber; via hole processing; weight; Bonding; Copper; Dielectric constant; Fiber lasers; Flip chip; Laminates; Optical design; Thermal expansion; Thermal resistance; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541001
