Title :
Influence of the microstructure on the stress state of solder joints during thermal cycling
Author :
Menk, Alexander ; Bordas, Stéphane
Author_Institution :
Robert Bosch GmbH, Stuttgart
Abstract :
The lifetime of a solder joint is mainly determined by its creep behaviour. Creep arises from the stresses inside the solder joints as a consequence of the thermomechanical mismatch of the board and the substrate. The stress state is heavily influenced by the anisotropy of tin. To understand the damage process in solder joints, the influence of the anisotropic microstructure must be understood. In this paper the influence of different grain sizes, shapes and orientations on the stress state is evaluated, based on numerical experiments.
Keywords :
creep; grain size; solders; thermomechanical treatment; anisotropic microstructure; creep behaviour; grain sizes; solder joints; stress state; thermal cycling; thermomechanical mismatch; Anisotropic magnetoresistance; Capacitive sensors; Creep; Fatigue; Lead; Microstructure; Soldering; Thermal stresses; Thermomechanical processes; Tin;
Conference_Titel :
Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on
Conference_Location :
Delft
Print_ISBN :
978-1-4244-4160-0
Electronic_ISBN :
978-1-4244-4161-7
DOI :
10.1109/ESIME.2009.4938405
