Development of single point-inner lead bonding technology using gold ball bumps

Author

Takizawa, Minoru ; Sasahara, Kazuhiko ; Mori, Ikuo

Author_Institution

Hino Works, Toshiba Corp., Tokyo, Japan

fYear

1995

fDate

4-6 Dec 1995

Firstpage

129

Lastpage

132

Abstract

Gold Ball Bumping and Single Point-Inner Lead Bonding (SP-ILB) technologies for manufacturing Tape Carrier Package (TCP) have been developed. After the analysis the gold ball bumps formation technology was selected. This technology can reduce costs and establish an easier bumps formation process than the general plated-bumps formation technology. Also the SP-ILB technology was selected. This technology can bring better coplanarity among the bonding tool, the set of bumps and the leads of TCP, and more stable bonding force each bumps than the Gang-ILB technology. Now these technologies have been applied to the ultra-compact and high density terminals of Personal Handy Phone Systems (PHS)

Keywords

gold; lead bonding; packaging; Au; Personal Handy Phone System; SP-ILB technology; gold ball bump; single point-inner lead bonding; tape carrier package; ultra-compact high density terminal; Aluminum; Artificial intelligence; Bonding forces; Costs; Gold; Intermetallic; Large scale integration; Manufacturing; Plastic packaging; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International

Conference_Location

Omiya

Print_ISBN

0-7803-3622-4

Type

conf

DOI

10.1109/IEMT.1995.541010

Filename

541010