Title :
Nanocomposite effects on the coefficient of thermal expansion modification for high performance electro-thermal microactuator
Author :
Tsai, Li-Nuan ; Cheng, Y.-T. ; Hsu, Wemyang
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fDate :
30 Jan.-3 Feb. 2005
Abstract :
We employ a low temperature stress free electroplated nickel (EL) process with the addition of uniformly dispersed nanoparticles of diamond (< 500 nm) or SiO2 (< 80 nm) to investigate "nanocomposite effects" for the first time on the modification of the thermal expansion coefficient (CTE) and other mechanical properties of nickel and its correlation to power and reliability improvement of electro-thermal microactuators. Experimental results show that these material parameters can be either enhanced or deteriorated via the incorporation of different kind of nanopowders. Although the mechanical strength enhancement can be attributed to the intrinsic characteristics of the nanoparticle based on the rule of mixture, the discrepancy of CTE modification can only be explained with distinct composite microstructures which result in the performance improvement of the electro-thermal microactuator. This work has led to a possible research direction in the development of MEMS using the nanocomposites.
Keywords :
electroplated coatings; microactuators; nanocomposites; nanoparticles; thermal expansion; C; MEMS; Ni; SiO2; coefficient of thermal expansion modification; diamond; electro-thermal microactuator; intrinsic characteristics; low temperature stress free electroplated nickel process; mechanical properties of nickel; mechanical strength enhancement; nanocomposite effects; nanoparticle; nanopowders; reliability improvement; thermal expansion coefficient; uniformly dispersed nanoparticles; Dispersion; Mechanical factors; Microactuators; Micromechanical devices; Microstructure; Nanoparticles; Nickel; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1453968