Title :
A new method of reducing the particle contamination in semiconductor manufacturing
Author :
Komagata, Michio
Author_Institution :
Niigata Sanyo Electron. Corp. Ltd., Niigata, Japan
Abstract :
In this paper, a new method of reducing particle contamination in semiconductor manufacturing is suggested. The factors of particle contamination are first listed by dividing the equipment into several blocks and several units. Then, these factors are investigated in order. In such a way, it becomes clear how the equipment generates the particles and where the particles move. Thus, we can take suitable measures to reduce particles
Keywords :
semiconductor device manufacture; LSI device yield; particle contamination reduction; particle generation; particle movement; semiconductor manufacturing; Contamination; Electronic equipment manufacture; Failure analysis; Large scale integration; Modems; Particle measurements; Pollution measurement; Pulp manufacturing; Random access memory; Semiconductor device manufacture;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541014
