DocumentCode
3423019
Title
MEMS reliability: metrology set-up for investigation of fatigue causes
Author
Millet, Olivier ; Blanrue, Olivier ; Legrand, Bernard ; Collard, Dominique ; Buchaillot, Lionel
Author_Institution
DELFM EMS, IEMN, Villeneuve d´´Ascq, France
fYear
2005
fDate
30 Jan.-3 Feb. 2005
Firstpage
483
Lastpage
486
Abstract
This paper deals with the investigation of the fatigue causes for polycrystalline structural layers. Metrology is set-up to understand the fatigue phenomenon for polycrystalline materials by targeting the failure mechanisms causes and locations. The tested structures are clamped-clamped beams. It is shown that fatigue is caused by grain modifications near microbridge clamped-ends.
Keywords
fatigue; mechanical variables measurement; micromechanical devices; reliability; MEMS reliability; clamped-clamped beams; failure mechanism causes; failure mechanism locations; fatigue causes investigation; grain modifications; metrology; microbridge clamped-ends; polycrystalline structural layers; Aging; Commercialization; Electrodes; Fatigue; Microelectronics; Micromechanical devices; Predictive models; Silicon; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-8732-5
Type
conf
DOI
10.1109/MEMSYS.2005.1453972
Filename
1453972
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